HomeWinBuzzer NewsSamsung Addresses Alledged Nvidia HBM Chip Performance Issues

Samsung Addresses Alledged Nvidia HBM Chip Performance Issues

HBM technology, which boosts data processing speeds by vertically stacking DRAM chips, is vital in AI cloud infrastructure.


Electronics has responded to claims that its high-bandwidth memory (HBM) products failed to meet Nvidia's stringent standards for power consumption and heat management. The allegations, initially reported by Reuters, suggested that Samsung's HBM chips did not align with 's specifications. However, Samsung has clarified through Business Korea that it is actively conducting tests for HBM supply with various global partners and is engaged in continuous technology and performance evaluations in close cooperation with multiple companies.

Addressing the report, Samsung Electronics emphasized its dedication to quality and reliability. The company stated, “We are making efforts to improve quality and enhance reliability for all our products. We are rigorously testing the quality and performance of our HBM products to provide the best solutions to our customers.

HBM Technology for AI Chips

HBM technology, which enhances data processing speed by vertically stacking multiple DRAM chips, is increasingly crucial in the burgeoning artificial intelligence (AI) market. As the demand for HBM grows, Samsung and its rival SK Hynix are in a tight race for market leadership. Despite its historical dominance in the memory semiconductor industry, Samsung has seen its market share in the HBM sector erode, prompting significant strategic changes within the company.

In response to the competitive pressures, Samsung recently replaced the head of its Device Solutions (DS) division, which oversees the semiconductor business. This leadership change highlights the company's commitment to regaining its competitive edge in the HBM market. Last month, Samsung commenced mass production of its fifth-generation HBM product, the HBM3E 8-layer, and plans to start mass production of the industry's first HBM3E 12-layer product in the second quarter of this year.

With Samsung holding approximately 40 percent of the HBM market, any inability to meet Nvidia's requirements could have far-reaching implications for the AI accelerator market. The ongoing competition between Samsung and SK hynix will likely shape the future landscape of HBM technology, influencing the development and deployment of worldwide.

The coming months will be critical for Samsung as it seeks to demonstrate the reliability and performance of its HBM products in a highly competitive market.

Markus Kasanmascheff
Markus Kasanmascheff
Markus is the founder of WinBuzzer and has been playing with Windows and technology for more than 25 years. He is holding a Master´s degree in International Economics and previously worked as Lead Windows Expert for Softonic.com.